taga fu'a

Alamanuia Tala Fou: Samsung's Innovation i Semiconductor Packaging Materials: O se Suiga Taaloga?

Alamanuia Tala Fou: Samsung's Innovation i Semiconductor Packaging Materials: O se Suiga Taaloga?

Samsung Electronics' Device Solutions division o loʻo faʻavavevaveina le atinaʻeina o se mea fou faʻapipiʻi e taʻua o le "glass interposer", lea e faʻamoemoe e sui ai le tau silicon interposer. Ua maua e Samsung ni talosaga mai le Chemtronics ma le Philoptics e atia'e ai lenei tekonolosi e fa'aaoga ai le tioata Corning ma o lo'o iloilo toto'a avanoa galulue fa'atasi mo ana fa'atauga.

I le taimi nei, Samsung Electro - Mechanics o loʻo faʻalauteleina foʻi le suʻesuʻega ma le atinaʻeina o laupapa vaʻavaʻa tioata, fuafua e ausia le tele o gaosiga i le 2027. Pe a faʻatusatusa i tuʻufaʻatasia masani silicon interposers, tioata interposers e le gata e maualalo tau ae o loʻo i ai foi le sili atu le lelei o le faʻamautuina o le vevela ma le seismic resistance, lea e mafai ona faʻafaigofie ai le gaosiga o le micro-circuit process.

Mo pisinisi fa'apipi'i fa'aeletoroni, o lenei fa'afouga e ono aumaia ai avanoa fou ma lu'itau. O la matou kamupani o le a mataʻituina lelei nei faʻatekonolosi alualu i luma ma taumafai e atiaʻe mea faʻapipiʻi e mafai ona sili atu ona fetaui ma faiga fou o le afifiina o le semiconductor, faʻamautinoa e mafai e a matou lipine feaveaʻi, ufiufi lipine, ma reels ona tuʻuina atu le puipuiga ma le lagolago mo le gaosiga fou o oloa semiconductor.

封面照片+正文照片

Taimi meli: Feb-10-2025