SAN JOSE -- Samsung Electronics Co. o le a faʻalauiloaina auaunaga faʻapipiʻi tolu-dimensional (3D) mo le manatua maualuga-bandwidth (HBM) i totonu o le tausaga, o se tekinolosi faʻamoemoe e faʻalauiloaina mo le faʻataʻitaʻiga lona ono-augatupulaga o le HBM4 faʻataʻitaʻiga i le 2025, e tusa ai ma punaoa a le kamupani ma alamanuia.
I le aso 20 o Iuni, na fa'aalia ai e le kamupani fai mea'ai chip manatua aupito tele i le lalolagi ana tekonolosi fa'apipi'i masini ma fa'afanua auala tautua i le Samsung Foundry Forum 2024 na faia i San Jose, Kalefonia.
O le taimi muamua lea na faʻasalalau ai e Samsung le tekonolosi faʻapipiʻi 3D mo tupe meataalo a le HBM i se faʻasalalauga lautele.I le taimi nei, o meataalo HBM o loʻo faʻapipiʻiina faʻatasi ma le tekonolosi 2.5D.
Na oʻo mai pe a ma le lua vaiaso talu ona faʻaalia e Nvidia le faʻavae ma le Pule Sili Jensen Huang le faʻataʻitaʻiga fou o lona fausaga AI Rubin i le taimi o se tautalaga i Taiwan.
HBM4 atonu o le a faʻapipiʻiina i le Nvidia's fou Rubin GPU faʻataʻitaʻiga faʻamoemoe e lavea le maketi i le 2026.
SO'OGA TUSI
O le tekonolosi fou a Samsung e faʻaalia ai meataalo HBM o loʻo faʻapipiʻi i luga o le GPU e faʻavavevave ai le aʻoaʻoina o faʻamatalaga ma le faʻaogaina o faʻamatalaga, o se tekinolosi ua manatu o se suiga o taaloga i le maketi AI chip.
I le taimi nei, o meataalo HBM o loʻo fesoʻotaʻi faʻatasi ma se GPU i luga o se masini faʻapipiʻi i lalo ole tekinolosi faʻapipiʻi 2.5D.
I le fa'atusatusaga, e le mana'omia e fa'apipi'i 3D se mea fa'apipi'i fa'asolo, po'o se mea manifinifi e nofo i le va o tupe meataalo e fa'ataga ai latou e feso'ota'i ma galulue fa'atasi.Ua fa'aigoaina e Samsung lana tekonolosi fa'apipi'i fou o SAINT-D, fa'apuupuu mo le Samsung Advanced Interconnection Technology-D.
AUAUNAGA TURI
O loʻo malamalama le kamupani Korea i Saute e ofoina atu le afifiina o le 3D HBM i luga o se faʻavae turnkey.
Ina ia faia lea mea, o le a fa'afeso'ota'i tu'usa'o e lana 'au fa'apipi'i meataalo HBM na gaosia i lana vaega o pisinisi fa'amanatu fa'atasi ai ma GPU ua fa'apotopotoina mo kamupani fa'alilolilo e lana vaega fa'avae.
"O le afifiina o le 3D e faʻaitiitia ai le faʻaaogaina o le eletise ma le tuai o gaioiga, faʻaleleia le lelei o faailo eletise o meataalo semiconductor," o le tala lea a le Samsung Electronics.I le 2027, ua fuafua Samsung e faʻafeiloaʻi uma-i-le tasi tekinolosi tuʻufaʻatasiga faʻatasi e aofia ai elemene mataʻutia e faʻateleina ai le saoasaoa o faʻamatalaga faʻasalalau o semiconductor i totonu o se tasi afifi tuʻufaʻatasia AI accelerators.
E tusa ai ma le faʻatupulaia o le manaʻoga mo tupe meataalo maualalo, maualuga le faʻatinoga, ua fuafua le HBM e faia le 30% o le maketi DRAM i le 2025 mai le 21% i le 2024, e tusa ai ma TrendForce, o se kamupani suʻesuʻe Taiwanese.
O le MGI Research e faʻatatau i le maketi o faʻasalalauga faʻapitoa, e aofia ai le afifiina 3D, e tupu i le $ 80 piliona i le 2032, faʻatusatusa i le $ 34.5 piliona i le 2023.
Taimi meli: Iuni-10-2024